SCR Copper Design Contest 1999-2000

This project, an award winning team work for the SRC Copper Cirucit Design Challenge, investigated the protection circuit issues in advanced 0.18um copper interconnect technology.

REFERENCES:

• H. G. Feng, K. Gong, and A. Z. Wang, "A Comparison Study of ESD Protection for RFIC's: Performance vs. Parasitics", SRC Publication: 2000 Publications in Copper Design Challenge, Pub. P000375, 17-Mar-2000.

• H. G. Feng, K. Gong and A. Wang, " ESD Protection Design Using Copper Interconnects: More Robustness and Less Parasitics", Proc. IEEE RFIC Symp., pp235-238, 2000.